Magnetic device using ferromagnetic film, magnetic recording medium using ferromagnetic film, and device using ferroelectric film

ABSTRACT

A unit element of a magnetic device or a ferroelectric device and magnetic particles of a magnetic recording medium are provided. The outline of the unit element and the magnetic particles is arranged so as to have a portion topologically identical to one of a letter-C shape and a letter-S shape that correspond to the magnetization or polarization distribution immediately before the rotation of magnetization or polarization.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to magnetic devices and magneticrecording media using ferromagnetic films and to devices employingferroelectric films. The present invention is particularly directed toimprovements on the dimensions of the elements and magnetic particles soas to achieve uniform coercive force and coercive field characteristicsand to contribute to miniaturization of the devices.

2. Description of the Related Art

Various devices utilizing the giant magnetoresistive (GMR) effect andthe tunneling magnetoresistive (TMR) effect have been known in the art.Examples of such devices include magnetic recording elements andmagnetic read heads.

FIG. 1 shows a basic structure of a magnetic random access memory. Anexample of the magnetic random access memory can be found in Wang etal., IEEE Trans. Magn. 33 (1997), 4498. Referring to FIG. 1, themagnetic random access memory is basically constituted from memoryelements which are either GMR elements or TMR elements, word lines, andbit lines, which also function as sense lines. The word lines areorthogonal to the bit lines, and the memory elements are held betweenthe word lines and the bit lines at the intersections thereof. Note thatin FIG. 1, reference symbol W denotes the width of each memory elementin the direction parallel to the bit lines and reference symbol Ldenotes the length of each memory element in the direction parallel tothe word lines.

Referring now to FIG. 2, a first end of the memory element is connectedto the bit line, and a second end of the memory element is connected viaa lead to a logic circuit that selects a memory cell. In the exampleshown in FIG. 2, a field effect transistor (FET) constituted from asilicon substrate, a drain D, a source S and a gate G is connected tothe second end of the memory element via a plug (interconnecting lead).Note that FIG. 2 illustrates an example using a TMR element. The TMRelement is constituted from a free layer composed of CoFe, NiFe, or thelike, a barrier layer composed of Al₂O₃ or the like, a reference layercomposed of CoFe or the like, a non-magnetic layer composed of Ru or thelike, a fixed layer composed of CoFe or the like, and anantiferromagnetic layer composed of PtMn or the like. These layers arearranged in that order when viewed from the bit line side. A GMR elementhas basically the same multilayer structure as that of theabove-described TMR element and only differs from the TMR element instructural details such as the absence of barrier layer, etc.

The combination of the anisotropic magnetic field in the soft magneticfree layer and the demagnetization field determined by the size of thefree layer defines the magnetic field necessary for rotating themagnetization direction of the free layer, i.e., the coercive force Hc.

FIG. 3 is an enlarged perspective view of the free layer, the referencelayer, and the fixed layer of the memory element. In the drawing, thebold arrow in each layer indicates the magnetization direction of thatlayer. As shown in the drawing, the x axis extends along the long sideof rectangular layers and the y axis extends orthogonal to the x axis.Reference symbol W denotes the width of the memory element in the ydirection, and reference symbol L denotes the length of the memoryelement in the x direction. As shown in FIG. 3, easy axes of the freelayer and the fixed layer are substantially parallel to each other. Themagnetization direction of the reference layer is antiparallel to thoseof the free layer and the fixed layer.

The magnetization of the fixed layer is fixed by the antiferromagneticlayer. Given, for example, that bit information “1” is represented bythe magnetization direction of the free layer being oriented in adirection parallel to the magnetization direction of the reference layerand that bit information “0” is represented by the magnetizationdirection of the free layer being oriented in a direction antiparallelto the magnetization direction of the reference layer, the magnetizationdirection of the free layer rotates due to the magnetic field, inducedby a bit line current and a word line current, that exceeds theabove-described coercive force Hc. Magnetic recording is performedthrough such a rotation.

FIGS. 4A to 4C illustrate example structures of shield-type magneticread heads including read elements each disposed in the gap between apair of shields (for example, refer to C. Tsang et al., IEEE Trans.Magn. 30 (1994), 3801). The shield-type magnetic read head includes aread element, namely, a GMR element or a TMR element, a lower shield S1,and an upper shield S2. In the drawings, hard magnet layers forcontrolling magnetic domains, disposed adjacent to the read element, awrite head integrally formed above the read head, and so on are omittedfor the sake of simplicity of explanation. The GMR or TMR heads shown inFIGS. 4A to 4C are classified into three types according to thedirection of the sense current Is. FIG. 4A illustrates, for example, ahorizontal current-in-plane (CIP) GMR head in which an electric currentflows in the track direction. FIG. 4B illustrates, for example, avertical CIP GMR head in which an electric current flows in the heightdirection of the element. FIG. 4C illustrates, for example, acurrent-perpendicular-to-plane (CPP) GMR or TMR head in which a sensecurrent I_(S) flows in the thickness direction. The view of FIG. 4C ismade partially transparent for the sake of simplicity of explanation. Inthe FIGS. 4A to 4C, arrows in strip-shaped recording media represent therecording magnetization direction.

FIG. 5 illustrates another example structure including a TMR element.The TMR element is constituted from a free layer, a barrier layer, areference layer, a nonmagnetic layer, a fixed layer, and anantiferromagnetic layer arranged along the z axis in the drawing. Inshort, the TMR element in FIG. 5 has substantially the same layerstructure as that shown in FIG. 2. However, in FIG. 5, hard magnets #1and #2 are formed at the two sides of the TMR element, and thenonmagnetic layers NM are formed between the TMR element and the hardmagnets #1 and #2. Hard magnet layers for controlling the magneticdomains must be disposed at the two sides of the TMR element to orientthe magnetization direction of the free layer in the x axis direction.

FIG. 6 is an enlarged perspective view of the free layer, the referencelayer, and the fixed layer of the above TMR element. The hard magnetlayers for controlling the magnetic domains, a nonmagnetic layer, a baselayer, and a protection layer are omitted from the drawing. In thedrawing, a bold arrow in each layer indicates the magnetizationdirection of that layer. As shown in FIG. 6, the x axis extends alongthe long side of the rectangular layers and the y axis extendsorthogonal to the x axis. Reference symbol W denotes the width of theelement in the y direction, and reference symbol L denotes the length ofthe element in the x direction. As shown in FIG. 6, whereas the easyaxis of the free layer extends substantially in the x-axis direction,the easy axes of the reference layer and the fixed layer are orthogonalto the easy axis of the free layer. The magnetization directions of thereference layer and the fixed layer are antiparallel to each other. Themagnetization direction of the fixed layer is pinned by theantiferromagnetic layer.

FIGS. 7A and 7B are schematic plan views showing the shape of theabove-described memory element and the read element. The memory elementand read element are formed into a rectangular shape, as shown in FIG.7A, or into an elliptic shape, as shown in FIG. 7B. In FIG. 7A,reference symbol W denotes the breadth of the element, and referencesymbol L denotes the longitudinal length of the element. In FIG. 7B,reference symbol W denotes the length of the short axis and referencesymbol L denotes the length of the long axis. In FIG. 7B, the element isformed into an elliptic shape to make the demagnetizing field as uniformas possible inside the element.

Known magnetic recording elements and magnetic read elements, however,suffer from the following technical bottlenecks:

-   -   (1) Since the variation in the coercive force Hc among magnetic        memory elements is large, practical production of the magnetic        memory element is difficult; and    -   (2) For magnetic read elements, as the element size is reduced,        a decrease in the sensitivity occurs due to the hard magnet        layers for controlling magnetic domains, and thus magnetic read        heads for higher-density media are difficult to design.

First, regarding point (1) above, in order to put magnetic random accessmemories having a storage capacity comparable to that of currentwidespread flash RAMs or DRAMs into practical use, all 10⁶ to 10⁹magnetic memory elements must exhibit a uniform coercive force Hc. Ifthe variation in Hc is 50% or more, the magnetization rotating currentmay differ by as much as 200% or more between some elements. Inpractice, this precludes selective recording.

As the size of magnetic memory elements decreases, the ratio of thedemagnetizing field in coercive force Hc increases. Since thedemagnetizing field is heavily dependent on the size and shape of theelement, the variation in the coercive force Hc tends to increase ininverse proportion to the size of the elements. For the purpose ofillustration, the dependency of the coercive force Hc on the elementsize was examined using a magnetic memory element having a free layermade of CoFe 2 nm in thickness. The results are shown in FIGS. 8 and 9.

In the graph of FIG. 8, characteristics of square and rectangularelements, i.e., box-shaped elements, as shown in FIG. 7A, when theaspect ratio W:L is varied are shown. The abscissa represents 1/W (unit:1 μm), and the ordinate represents the coercive force Hc (unit:Oe=10³/4π A/m).

In the graph of FIG. 9, characteristics of elliptic elements, as shownin FIG. 7B, are shown. The aspect ratio W:L is varied. The abscissa andthe ordinate are the same as in FIG. 8.

In these graphs of FIGS. 8 and 9, solid lines connecting circularsymbols represent the characteristics of an element having an aspectratio W:L=1:1, long dotted lines connecting square symbols represent thecharacteristics of an element having an aspect ratio W:L=1:2, and shortdotted lines connecting rhombus symbols represent the characteristics ofan element having an aspect ratio W:L=1:3. An inclined straight lineextending from the origin represents the characteristic according to thetheoretical formula: Hc=2πMs(t/W), wherein Ms denotes the intensity ofthe magnetization, and t denotes the thickness.

As shown in these graphs, theoretically, the demagnetizing field issupposed to increase in inverse proportion to the length W of the shortside of the element. However, this is not the case in practice.Particularly when the aspect ratio W:L is low, deviation from thetheoretical value is significant. Since the number of the magneticmemory elements is large, as described above, it is preferred that thecoercive force Hc be constant although some degree of variation in theaspect ratio may be observed.

Secondly, regarding point (2) above, in order to read higher-densityrecording media, the size of the read element installed in the magneticread head must be reduced. Such a reduction in size increases therelative thickness of the domain walls at the ends of the free layer ofthe read element.

FIG. 10 is a graph showing the resistance/magnetic field characteristicsof read elements each having a NiFe free layer with a track width L of0.1 μm and 2 nm in thickness. No hard magnet layers for controlling themagnetic domains are provided for the read elements. The abscissaindicates the magnetic field (unit: Oe=10^(3/4)π A/m) in the y axisdirection in FIG. 6, and the ordinate indicates the resistance R(arbitrary units). In the graph, the solid lines connecting circularsymbols represent the characteristics of read elements having an aspectratio W:L=1:1, the long dotted lines connecting square symbols representthe characteristics of read elements having an aspect ratio W:L=1:2, andthe short dotted lines connecting rhombus symbols represent thecharacteristic of read elements having an aspect ratio of 1:3.

As the thickness of the magnetic walls increases, hysteresis appears inthe resistance/magnetic field curves of the read elements. In otherwords, when the aspect ratio is large, the curve around zero magneticfield is a straight line; however, the curve clearly exhibits hysteresisas the aspect ratio decreases.

The aspect ratio is preferably as small as is feasibly possible so as toread higher density media. However, read elements must maintain aparticular magnetization state when no signals are provided and mustrespond linearly to an external magnetic field. In other words, readelements with a large coercive force Hc and hysteresis are notpreferred. In order to eliminate hysteresis, hard magnet layers forcontrolling the magnetic domains are provided at the two sides of theelement so as to forcibly orient the magnetization direction of the freelayer in the track direction by the biasing magnetic field from thesehard magnet layers. However, application of the biasing magnetic fieldfrom the hard magnet layers inhibits the rotation of the magnetizationof the free layer, thereby drastically decreasing the sensitivity to theexternal magnetic field. In other words, small elements suffer from adecrease in the sensitivity because of the presence of the hard magnetlayers.

As for the problem of point (1) above, defect-free bulk memories can bemanufactured by making the coercive force Hc uniform over all theelements. In contrast, as for the problem of point (2) above, thecoercive force Hc needs to be eliminated so as to decrease the biasingmagnetic field of the hard magnet layers as much as possible and tomanufacture magnetic read heads having high sensitivity. In other words,the object in point (1) is to maintain the coercive force Hc in thehysteresis curve in the easy axis direction of the free layer at aparticular level; and the object in point (2) is to reduce the coerciveforce to zero in the hysteresis curve in the hard axis direction of thefree layer. These objects appear contradictory but can be achievedsimultaneously if the magnetization of the free layer can rotatesimultaneously. The means for achieving these objects is the same.

The dependency of the coercive force characteristic on the size andshape of the element can be confirmed through investigation of themagnetization distribution immediately before rotation.

FIGS. 11A, 11B, 12A, and 12B show example magnetization distributionsimmediately before the rotation of the magnetization. The distributionsare estimated by carrying out a micromagnetics simulation. FIGS. 11A and11B show the distributions in rectangular elements, and FIGS. 12A and12B show the distributions in elliptic elements. In the drawings, arrowsinside the frames represent magnetization distributions, and streamlinesabove the frames schematically illustrate the general directions of themagnetization.

A large rectangular element of, for example, 1/W=1.5 μm⁻¹, has a vortexdistribution, as shown in FIG. 11A. A small rectangular element of, forexample, 1/W=3.0 μm⁻¹, has a distribution resembling the shape of letterS (hereinafter, the “S distribution”), as shown in FIG. 11B.

A large elliptic element of, for example, 1/W=1.5 μm⁻¹, has a vortexdistribution, as shown in FIG. 12A. A small elliptic element of, forexample, 1/W=3.0 μm⁻¹, has a distribution resembling the shape of letterC (hereinafter, the “C distribution”), as shown in FIG. 12B.

Note that the C and S distributions can be considered as a low-levelbuckling magnetic wall. Whereas buckling magnetic wall has manyundulations, the number of undulations in the C and S distributions islow. The state of the magnetic wall in the element is determinedaccording to the balance between the demagnetizing field energy, theanisotropic energy, the exchange coupling energy, and the Zeeman energy.

As the size of the element is reduced, the relative strength of thedemagnetizing field energy increases, resulting in changes inmagnetization distribution immediately before the rotation of themagnetization. Presumably, in most cases, the vortex distribution has arelatively large coercive force Hc, and the S and C distributions have arelatively small coercive force Hc.

It should be noted that the above description can be applied not only todevices using ferromagnetic layers but also to devices usingferroelectric layers. When applied to devices using ferroelectriclayers, the demagnetizing field corresponds to the depolarization field,and the coercive force Hc corresponds to the coercive field Ec.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a micro device usinga ferromagnetic or ferroelectric film that achieves uniformity incoercive force or coercive field.

To achieve this object, the outline of a unit element or magneticparticles that constitute the device is formed to have a portiontopologically identical to a letter-C shape or a letter-S shapecorresponding to the magnetization or polarization distributionimmediately before the rotation.

The present invention specifies the boundary conditions of the outlineof the unit element or magnetic particles so that the uniformity inmagnetization distribution immediately before magnetization rotation andin polarization distribution immediately before polarization rotationcan be achieved. In this manner, the magnetic or polarizationdistribution inside the unit element or the magnetic particles can becontrolled, and uniformity in coercive force or coercive field can beachieved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a magnetic random access memory;

FIG. 2 is a schematic view of a tunneling magnetoresistive (TMR) elementfunctioning as a memory element;

FIG. 3 is a schematic view of a free layer, a reference layer, and afixed layer showing the structure of a rectangular magnetic element;

FIGS. 4A to 4C are perspective views showing example structures ofshield-type magnetic heads incorporating read elements;

FIG. 5 is a schematic view showing the structure of a read element usinga TMR element;

FIG. 6 is a schematic view of a free layer, a reference layer, and afixed layer of a shield-type read element;

FIG. 7A is a plan view of a rectangular magnetic memory element or arectangular read element and FIG. 7B is a plan view of an ellipticmagnetic memory element or a elliptic read element.

FIG. 8 is a graph showing the dependency of the coercive force on thesize of box-shaped magnetic memory elements;

FIG. 9 is a graph showing the dependency of the coercive force on thesize of elliptic magnetic memory elements;

FIG. 10 is a graph showing the resistance/magnetic field characteristicsof box-shaped magnetic memory elements;

FIG. 11A shows the magnetization distribution of a large rectangularmagnetic memory element immediately before rotation of themagnetization, and FIG. 11B shows the magnetization distribution of asmall rectangular magnetic memory element immediately before rotation ofthe magnetization;

FIG. 12A shows the magnetization distribution of a large ellipticmagnetic memory element immediately before rotation of themagnetization, and FIG. 12B shows the magnetization distribution of asmall elliptic magnetic memory element immediately before rotation ofthe magnetization;

FIG. 13 shows the arrangement of a free layer, a reference layer, and afixed layer of a semi-elliptic magnetic memory element according to thepresent invention;

FIG. 14 shows the arrangement of a free layer, a reference layer, and afixed layer of a semi-elliptic magnetic read element according-to thepresent invention;

FIG. 15 is graph showing the dependency of the coercive force on thesize of semi-elliptic magnetic memory elements of the present invention;

FIG. 16 is a graph showing the resistance/magnetic field characteristicsof semi-elliptical magnetic memory elements of the present invention;

FIG. 17A shows the magnetization distribution of a large semi-ellipticmagnetic memory element immediately before rotation of the magnetizationaccording to the present invention, and FIG. 17B shows the magnetizationdistribution of a small semi-elliptic magnetic memory elementimmediately before rotation of the magnetization according to thepresent invention;

FIG. 18A to 18H show example outlines of semi-elliptic elements;

FIG. 19I to 19N show other example outlines of semi-elliptic elements;

FIG. 20 is a schematic view showing the outline of an element;

FIG. 21 shows an example structure of a TMR element having a free layerat the bottom;

FIG. 22 shows an example structure of a TMR element including a hardmagnet layer for controlling the magnetic domains;

FIG. 23 shows an example structure of a TMR element including aplurality of free layers;

FIG. 24 shows an example structure of a TMR element including aplurality of barrier layers and an antiferromagnetic layer;

FIG. 25 is a schematic cross-sectional view for explaining a knownlongitudinal magnetic recording medium;

FIG. 26 is a schematic cross-sectional view for explaining a knownperpendicular magnetic recording medium;

FIG. 27 is a schematic cross-sectional view for explaining alongitudinal magnetic recording medium of the present invention formedby ferromagnetic particles having a semi-elliptical cross section;

FIG. 28 is a schematic cross-sectional view for explaining aperpendicular magnetic recording medium of the present invention formedby ferromagnetic particles having a semi-elliptical cross section;

FIG. 29 is a schematic cross-sectional view for describing the structureof a known memory device using a ferroelectric film in a memory cell;

FIG. 30 shows the structure of a memory device using a ferroelectricfilm of the present invention in a memory cell, the ferroelectric filmbeing disposed above a logic circuit; and

FIG. 31 is a schematic cross-sectional view of a memory device using aferromagnetic film of the present invention in a memory cell, thesemi-elliptic ferroelectric film being disposed inside a trench.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention relates to devices and magnetic recording mediausing ferromagnetic films and to devices using ferroelectric films.

Examples of magnetic devices include: magnetic recording devices such asmagnetic random access memories (RAMs) and recording devices usingmagnetic RAMs; and magnetic sensing devices such as read elements, readheads, magnetic read devices using read elements or read heads, sensingelements, magnetic field sensors, and magnetic sensing devices usingsensing elements or magnetic sensors.

Each of these magnetic devices has a unit element that includes aferromagnetic film. Examples of unit elements include memory elements,read elements, and magnetic sensing elements. The number of the unitelements used in a magnetic device can be any, but is generally large.

When the unit element is a memory element, e.g., a magnetic memoryelement shown in FIGS. 1 and 2, information is written on and read fromthe element discretely. However, the present invention is not limited tosuch a discrete form and can be applied to a continuous recordingmedium, as described below.

Moreover, the present invention can be applied to devices usingferroelectric films. Examples of unit elements of such devices includememory elements and capacitative elements.

In this specification, the embodiments of magnetic devices are describedfirst, continuous recording media next, and ferroelectric devices last.

In the above-described known box-shaped or elliptic elements, as shownin FIG. 7, the contribution of the demagnetizing field energy in thetotal magnetic energy varies. As a result, various magnetizationdistributions are observed immediately before the rotation of themagnetization, resulting in the variation in coercive force Hc. Theshape of the element that can control the magnetization distributionimmediately before the magnetization rotation needs to be specified toovercome the problem.

In other words, a variation in coercive force Hc can be substantiallyeliminated by making the magnetization distribution immediately beforethe magnetization rotation always the same. The boundary conditions ofthe element shape that can control the magnetization distribution insidethe elements or magnetic particles must be specified.

On the other hand, the results of a magnetic distribution simulation ofrectangular and elliptic elements show that the S distribution or the Cdistribution, i.e., a low-level buckling magnetic wall, appears as thesize of the element is reduced.

The vortex distributions, as shown in FIGS. 11A and 12A, are too complexto control by the shape of the element. However, the unit element can beformed to have a portion topologically identical to a desired C or Sdistribution so as to control the magnetization distribution immediatelybefore the magnetization rotation.

In this specification, the language “topologically identical” means thata shape can be obtained from another shape by a topologicaltransformation. For example, a sphere cannot be transformed into atorus, and a circle cannot be transformed into a horizontalcross-sectional shape of a torus, i.e., a doughnut shape.

Moreover, the magnetization distribution immediately before the rotationof magnetization can be effectively prevented from widely varying whenthe unit element is shaped so as not to have rotational symmetries withrespect to the magnetization easy axis or hard axis. Since theabove-described box shapes and elliptic shapes have a 180° rotationalsymmetry, elements having such shapes exhibit a wide variety ofmagnetization distribution before magnetization rotation and thusdemonstrate a large variation in the coercive force Hc. This tendency isparticularly acute in circular or square elements having high rotationalsymmetry. Thus, the elements preferably have portions topologicallyidentical to the shape of letter C or letter S and are preferablyasymmetrical.

Note that when the C distribution and the S distribution are compared,the S distribution is of a higher magnetization mode, i.e., has a highertotal energy. This can be understood from that an S distribution is thecombination of two C distributions. The lower the total energy, the morestable the elements are. Moreover, since the S distribution has poorcompatibility to a biasing magnetic field working in a single direction,the C distribution is preferred to the S distribution.

FIGS. 13 and 14 show example semi-elliptic elements having the outlineincluding the shape of letter C. FIG. 13 shows an example of a magneticmemory element, and FIG. 14 shows an example of a read element. Notethat in these drawings, only the free layer, the reference layer, andthe fixed layers are depicted. FIGS. 13 and 14 correspond respectivelyto FIGS. 3 and 6 described above. Since the overall structure of thememory device and the read device have been described above withreference to FIGS. 1 and 4, only the essence of the invention isdescribed below.

The bold arrows in FIG. 13 each represent the direction of the easy axisof the corresponding layer.

Referring to FIG. 13, the free layer, the reference layer, and the fixedlayer have the same semi-elliptic shape. Using the free layer as anexample, the outline of the layer consists of an arc portion 1 a and astraight portion 1 b. In other words, the outline of the semi-ellipseconsists of two paths between the apexes A and B. The arc portion 1 a istopologically identical to the above-described letter-C shape. The arcportion 1 a enables the C distribution of the magnetization. Thestraight portion 1 b allows concentration of positive and negativemagnetic charges in the C magnetization distribution.

In FIG. 13, the x axis is parallel to the straight portion 1 b, and they axis is orthogonal to the x axis. Reference symbol L denotes thelength of the element in the x axis direction, and reference symbol Wdenotes the length of the element in the y axis direction. As shown inthe drawing, the easy axes of the free layer and the fixed layer areparallel to each other, and the easy axis of the reference layer isantiparallel to those of the free layer and the fixed layer.

Referring now to FIG. 14, the free layer, the reference layer, and thefixed layer of a read element 2 have easy axes represented by thecorresponding bold arrows. The hard magnet layers for controllingmagnetic domains, the nonmagnetic layer, the base layer, and theprotection layer are omitted for the purpose of simplification.

The read element 2 is also semi-elliptic when viewed from above theelement. For example, the outline of the free layer consists of an arcportion 2 a and a straight portion 2 b. The arrangement of the x and yaxes, the definitions of the reference characters W and L aresubstantially the same as in FIG. 13. However, the easy axis of thereference layer is parallel to the y axis, and the easy axis of thefixed layer is antiparallel to the y axis. In other words, the easy axesof the reference layer and the fixed layer are orthogonal to the easyaxis of the free layer extending in the x-axis direction. Themagnetization direction of the reference layer is antiparallel to thatof the fixed layer, and the magnetization of the fixed layer is fixed byan antiferromagnetic layer (not shown in the drawing).

In the read element 2, the arc portion 2 a, which is topologicallyidentical to the above-described letter-C shape, enables the Cdistribution of the magnetization. The straight portion 2 b allowsconcentration of positive and negative magnetic charges having the Cmagnetization distribution.

FIG. 15 is a graph showing the dependency of the coercive force Hc ofthe semi-elliptic magnetic memory element shown in FIG. 13 on the sizeof the element.

FIG. 15 shows the characteristic of the memory element 1 when the aspectratio W:L is varied. The abscissa indicates 1/W (unit: 1 μm), and theordinate indicates the coercive force Hc (unit: Oe=10³/4π A/m). A solidline connecting circular symbols represents the characteristic of anelement having an aspect ratio W:L=1:1, a long dotted line connectingsquare symbols represent the characteristic of an element having anaspect ratio W:L=1:2, and a short dotted line connecting rhombus symbolsrepresents the characteristic of an element having an aspect ratioW:L=1:3. An inclining straight line extending from the origin representsthe theoretical-characteristic according to a formula: Hc=2πMs(t/W).

The graph shows that the coercive force increases in proportion to 1/Wdespite a change in aspect ratio and that the variation in coerciveforce Hc is significantly decreased. In the graph, the phrase “C-STATE”is inserted to indicate that the magnetization distribution immediatelybefore is the C distribution.

FIG. 16 shows resistance/magnetic field characteristics of read elementshaving a semi-elliptic shape as with the read element 2 described above.No hard magnet layers for controlling magnetic domains were provided tothe read elements. The abscissa indicates the magnetic field (unit:Oe=10^(3/4)π A/m) in the y axis direction in FIG. 14, and the ordinateindicates the resistance R (arbitrary units). In the graph, a solid lineconnecting circular symbols represents the characteristic of a readelements having an aspect ratio W:L=1:1, a long dotted line connectingsquare symbols represents the characteristic of a read element having anaspect ratio W:L=1:2, and a short dotted line connecting rhombus symbolsrepresents the characteristic of a read element having an aspect ratioof 1:3.

FIG. 16 shows that an increase in coercive force Hc is gentle even whenthe aspect ratio is low. When the aspect ratio is larger than 1:1, themagnetization of the semi-elliptic element is presumably rotatedsimultaneously even when no biasing magnetic field is applied. FIG. 16clearly shows that the hysteresis is suppressed, when compared with FIG.10.

FIGS. 17A and 17B show an example magnetic distribution immediatelybefore the rotation of magnetization estimated by a micromagneticssimulation technique.

FIG. 17A shows a magnetic distribution of a large element of, forexample, 1/W=1.5 μm⁻¹. As shown in FIG. 17A, the element exhibits the Cdistribution. FIG. 17B shows a magnetic distribution of a small elementof, for example, 1/W=3.0 μm⁻¹. As shown in FIG. 17B, the elementexhibits the C distribution. This assumes that the elements can exhibitthe C distribution regardless of their size.

In view of the above, uniformity in coercive force Hc can be achieved ifunit elements of magnetic devices can be formed to have a portiontopologically identical to the C distribution immediately before therotation of the magnetization.

The shape of the element that achieves the above-described objects isnot limited to the semi-elliptic shape described above. Examples ofother shapes are illustrated in FIGS. 18A to 18H. Each of FIGS. 18A to18H illustrates an outline of an element when viewed from a directionperpendicular to the plane that includes the easy axis and the hardaxis.

FIG. 18A shows an outline having an arc portion comprising a pluralityof straight line segments obtained by a polygonal approximation of anarc. FIG. 18B shows a triangular outline formed by connecting threeapexes with straight line segments. FIG. 18C shows an outline consistingof an arc portion and an inwardly curved portion. FIG. 18D shows anoutline consisting of an arc portion and an outwardly curved portion.FIG. 18E shows an outline having two rounded apexes. FIG. 18F shows anoutline which is not symmetrical. FIG. 18G shows an outline having twoarc portions. FIG. 18H shows an outline formed by replacing part of anarc portion with a straight line segment.

In each of the drawing, reference characters A to D denote apexes, andarrows R indicate that the pointed sections are being rounded.

The outline shown in FIG. 18A consists of a straight line AB and a setof straight line segments obtained by a polygonal approximation of anarc AB.

The outline shown in FIG. 18B is triangular and formed by connectingthree apexes A, B, and C with straight lines. The number of apexes isnot limited to three, and can be increased to form complex polygonalshapes.

The outline shown in FIG. 18C has no straight segment between the pointA and the point B. The outline consists of an arc and an inwardly curvedsegment. The area of this shape is smaller than that of thesemi-elliptic shape. The outline shown in FIG. 18D consists of an arcand an outwardly curved segment. The area of this shape is larger thanthat of the semi-elliptic shape.

The outline shown in FIG. 18E has rounded apexes A and B. Each of theseapexes is either constituted from at least one curved line or from aplurality of straight line segments obtained by a polygonalapproximation.

The outline shown in FIG. 18F is asymmetrical with respect to an axisperpendicular to the straight line segment AB, i.e., an axis in thedirection indicated by the double headed arrow W. The term“asymmetrical” means that the outline does not have line or planesymmetry.

The outline shown in FIG. 18G consists of two elliptic arcs AD and BCand two straight line segments AB and CD. The arc AD is larger than thearc BC. This outline clearly resembles the shape of letter C.Alternatively, the outline may include a combination of more than twoarcs.

The outline shown in FIG. 18H consists of an arc AD, an arc BC, astraight line segment AB, and a straight line segment DC. The shaperesembles a partly cut-away semi-ellipse.

Note that all the outlines shown in FIGS. 18A to 18H can be transformedinto one another without having to form a new hole, i.e., they aretopologically identical to one another.

As described above, examples of the shape of the unit element includethose having one elliptic arc, as shown in FIGS. 18C to 18F, and thosehaving more than two elliptic arcs, as shown in FIGS. 18G and 18H. Thearc may be entirely subjected to a polygonal approximation so as to beconstituted from a plurality of straight line segments, as shown in FIG.18A. Alternatively, the arc may be partly subjected to a polygonalapproximation or a linear approximation so that part of the arc isreplaced with a straight line segment, as shown in FIG. 18H. The shapeof element may be constituted from straight line segments connectingbetween three or more apexes, as shown in FIG. 18B. Moreover, the shapeof the element may be constituted from an elliptic arc and an inwardlyor outwardly curved line segment, as shown in FIGS. 18C and 18D. Theapexes may be rounded, as shown in FIG. 18E, or may be pointed.

The outline is selected according to various factors such as themanufacturing process of elements or the photomask accuracy. However,unnecessarily complicated shape should be avoided considering theefficiency of improving the coercive force or the like, themanufacturing cost, and prevention of an increase in the number ofmanufacturing steps.

Other examples of outlines that include a letter-C shape or a letter-Sshape are shown in FIGS. 19I to 19N. The shapes shown in FIGS. 19I and19J each consist of a plurality of semi-ellipses or approximatedsemi-ellipses. The outline shown in FIG. 19I is a combination of twosemi-ellipses or approximated semi-ellipses that are arranged to faceeach other. The two parts divided by the dotted line AB are notsymmetrical with respect to the dotted line AB. The outline shown inFIG. 19J is a combination of two semi-ellipses or approximatedsemi-ellipses that are displaced in the horizontal direction in thedrawing. The shape shown in FIG. 19J includes straight line segments ABand DC, and elliptic arcs AD and BC.

As shown in FIGS. 19K to 19N, the shape of the element may betrapezoidal or derived from a trapezoid. The shape shown in FIG. 19K istrapezoidal and includes an upper side AB and a lower side DC. The shapein 19L is trapezoidal but with rounded apexes A to D. In the shape shownin FIG. 19M, each of the upper side and the lower side of a trapezoid ischevron-shaped. In the shape shown in FIG. 19N, corners of the shapeshown in FIG. 19M are rounded. The outlines in FIGS. 19K to 19N areexamples consisting of segments connecting between four or more ofapexes. The corners of the shapes shown in FIGS. 19L and 19N arerounded.

FIG. 20 shows an example of a giant magnetoresistive (GMR) element or atunneling magnetoresistive (TMR) element having an outline partlytopologically identical to the C (or S) distribution. The element shownin FIG. 20 may be used as a unit element such as a memory element or aread element.

The structure of the element may include a free layer, a fixed layer,and an antiferromagnetic layer, stacked in that order or in the reversedorder, as shown in FIGS. 2 and 5. The position of the free layer is notlimited to the top of the stack.

FIGS. 21 to 24 are cross-sectional views showing example structures ofelements.

FIG. 21 shows a tunneling magnetoresistive element 3. The tunnelingmagnetoresistive element 3 includes a free layer, which is thebottommost layer, a barrier layer, a reference layer, a nonmagneticlayer, a fixed layer, and an antiferromagnetic layer, stacked in thatorder.

FIG. 22 shows a tunneling magnetoresistive element 4 including a hardmagnet layer. In the drawing, the shape of the hard magnet layer asviewed from above and the magnetization direction of thereof areindicated by the bold arrow.

In this example, the hard magnet film or layer is disposed at the top.The tunneling magnetoresistive element 4 includes an antiferromagneticlayer, a fixed layer, a nonmagnetic layer, a reference layer, a barrierlayer, a free layer, a nonmagnetic layer, and a hard magnet layer,stacked in that order.

The hard magnet layer is provided so as to induce biasing magnetic fieldthat promotes the C distribution of magnetization.

FIG. 23 shows a tunneling magnetoresistive element 5 having two freelayers. The tunneling magnetoresistive element 5 includes anantiferromagnetic layer, a fixed layer, a nonmagnetic layer (lowernonmagnetic layer), a reference layer, a barrier layer, a free layer(lower free layer), a nonmagnetic layer (upper nonmagnetic layer), and afree layer (upper free layer), stacked-in that order. Theantiferromagnetic layer is the bottommost layer.

The tunneling magnetoresistive element S may include more than two freelayers.

FIG. 24 shows a dual tunneling magnetoresistive element 6. The dualtunneling magnetoresistive element 6 includes two layers of nonmagneticfilms (barrier layers) that mostly produce the TMR effect.

The dual tunneling magnetoresistive element 6 basically includes astructure comprising an antiferromagnetic layer (secondantiferromagnetic layer), a fixed layer (first fixed layer), a freelayer, a fixed layer (second fixed layer), and an antiferromagneticlayer (second antiferromagnetic layer). The layer structure of theelement 6 shown in FIG. 24 shows symmetry with respect to the free layerat the middle. In other words, a barrier layer, a reference layer, anonmagnetic layer, a fixed layer, and an antiferromagnetic layer aredeposited on the free layer in that order. Another barrier layer,another reference layer, another nonmagnetic layer, another fixed layer,and another antiferromagnetic film are disposed under the free layer inthat order when viewed from the free-layer side. Such a dual structureincreases the magnetic resistance ratio and improves the electricalsensitivity of the element, namely, a memory element or a read element.Thus, if applied to a memory element, the error rate can be decreased,and, if applied to a read element, an increase in the output voltage canbe expected.

Although the tunneling magnetoresistive element 6 has two barrierlayers, as shown in the drawing, the number of the barrier layer can bemore than two.

Note that although examples of TMR elements are shown in FIGS. 21 to 24,these structures can be applied to the basic structures of GMR elements.The difference is, for example, absence of the barrier layer in the GMRelement. For example, a GMR element having a structure corresponding tothat shown in FIG. 24 includes two or more nonmagnetic films that mostlyproduce the GMR effect.

In the example elements described above, the free layer is constitutedfrom a ferromagnetic film. Each of the above-described elements, i.e.,unit elements, having a multilayer structure is used as a memory elementshown in FIG. 21 or as a read element shown in FIG. 24.

The above-described advantages of forming a ferromagnetic member to betopologically identical to the C distribution of magnetization can beachieved not only in magnetic memory elements or read elements but alsoin various other recording media formed by thin-film deposition orapplication of magnetic particles onto a disk (hard or flexible), atape, a card, a paper, or the like. In other words, the presentinvention can be applied to a continuous medium, as described below.

FIGS. 25 and 26 show a write head 7 and known recording media 8 and 9.FIG. 25 shows an example of a longitudinal medium, and FIG. 26 shows anexample of a perpendicular medium. In the drawings, the x axis indicatesthe moving direction of the write head 7 relative to the recording media8 and 9, i.e., the horizontal direction in the drawing. The y axis isorthogonal to the x axis. Reference character Gw represents a recordinggap length, and d represents the distance between the head and themedium. Rectangles inside the write head 7 represent conductors forexcitation.

Because the recording medium 8 in FIG. 25 is a longitudinal medium, themagnetization direction thereof is oriented in the x axis directionafter recording, i.e., the direction of the recording magnetization isthe x axis direction. The recording medium 9 includes a ferromagneticlayer formed on a keeper layer, as shown in FIG. 29, and is thus aperpendicular medium. The magnetization direction thereof is oriented inthe y axis direction after recording, i.e., the direction of therecording magnetization is the y axis direction.

The magnetic layers of known media have been constituted from granular,columnar, or spicular magnetic particles. However, in the presentinvention, the magnetic particles are formed to be partiallytopologically identical to the shape of letter C or S which resemblesthe magnetization distribution immediately before the rotation ofmagnetization. A magnetic recording medium of the present invention hasa ferromagnetic layer constituted from such magnetic particles. Thus,the coercive force can be made substantially uniform, and transitionalnoise generated from magnetization transition portions can be reduced.

FIGS. 27 and 28 show the recording head 7 and magnetic recording media10 and 11 made of the magnetic particles of the present invention. Thearrangement of the x and y axes and the definition of referencecharacters Gw and d are the same as those in FIGS. 25 and 26.

The magnetic recording medium 10 shown in FIG. 27 is a longitudinalmedium. The easy axis of the magnetic particles is arranged in thelongitudinal direction. The cross-sections of the magnetic particles aresubstantially semi-elliptic and the particles are aligned in the x axisdirection. In other words, a large number of magnetic particles havingC-shaped elliptic arcs are self-aligned in the direction of the easyaxis, and the straight line segments of the magnetic particles areregularly aligned in the longitudinal direction. Although a four-layerstructure is depicted in the drawing, no limit is imposed as to thenumber of layers.

The magnetic recording medium 11 shown in FIG. 28 is a perpendicularmedium. The easy axis of the magnetic particles is aligned perpendicularto a base face of the magnetic recording medium. The cross-sections ofthe magnetic particles are substantially semi-elliptic and are alignedin the y axis direction. In the magnetic recording medium 11, aferromagnetic layer is formed on a keeper layer, and a large number ofmagnetic particles having C-shaped elliptic arcs are self-aligned in theeasy axis direction, i.e., the y axis direction in the drawing, so thatthe straight line segments of the magnetic particles are regularlyaligned in the perpendicular direction. Here, the base face is theinterface between the keeper layer and the ferromagnetic layer.Alternatively, (the element may have no keeper layer.

Another example of the magnetic recording medium is an oblique medium.In an oblique medium, the easy axis of the magnetic particles isdistributed diagonally. The oblique medium can be suitably used in ahelical-scan-type recording tape or the like.

As for the three-dimensional shape of the magnetic particles, themagnetic particles may be of a shape obtained by rotating a semi-ellipseabout a longitudinal axis orthogonal to the straight line segment of thesemi-ellipse, i.e., part of the shape of a circular convex lens.Alternatively, as shown in FIG. 20, the magnetic particles may be of ashape obtained by moving a semi-ellipse in the direction orthogonal ordiagonal to the plane of the semi-ellipse. As for the two-dimensionalshape of the magnetic particles, various shapes such as those shown inFIGS. 18A to 19N may be employed.

Lastly, a ferroelectric device including a unit element, namely, amemory element or a capacitative element, using a ferroelectric filmwill now be described. Examples of the ferroelectric device includeferroelectric memory devices and the like.

FIG. 29 shows an example structure of a known memory element having aferroelectric film.

A ferroelectric film or layer is disposed between two parallelelectrodes opposing each other. One of the electrodes is connected to afield effect transistor (FET) via a plug. The FET is a MOSFET formed ina silicon substrate and includes a source S, a drain D, and a gate G.

The polarization of the ferroelectric film induces a depolarizationfield. Since the distribution of the depolarization field is notuniform, the domain structure of the ferroelectric film becomes complex.Such domain structure can be controlled by forming a ferroelectricmember to be topologically identical to the letter-C or letter S shapecorresponding to the polarization distribution immediately before therotation of the polarization. As a result, the coercive field Ec, atwhich the polarization rotates, can be made uniform.

FIG. 30 is a cross-sectional view of a ferroelectric device 12 disposedabove a logic circuit.

As shown in FIG. 30, the ferroelectric layer is curved into a letter-Cshape, which corresponds to the shape shown in FIG. 18G. A first end ofthe ferroelectric layer is connected to an electrode, and a second endthereof is connected to a source S of a MOSFET via a plug. The MOSFET isformed in a silicon substrate and constitutes part of the logic circuit.The ferroelectric layer has the shape of letter C when viewed from theside, i.e., the direction orthogonal to the plane that includes the axisof the polarization direction whereas a unit element of a magneticdevice has a portion having the shape of letter C when viewed fromabove, i.e., the direction orthogonal to the plane of the element.

FIG. 31 shows a ferroelectric device 13 having a ferroelectriccapacitative element (unit element) disposed inside a trench. Theferroelectric device 13 is rarely affected by disturbance.

In the ferroelectric device 13, a ferroelectric film is semi-elliptic,and a first end is connected to a buried plate, and a second end isconnected to a source S of a MOSFET. The FET has the same function asthat of FIG. 30.

The coercive field Ec can be made uniform by forming the ferroelectricfilm to have an elliptic arc portion corresponding to the letter-Cshape. As a result, the electrical potential for rotation of thepolarization applied to the electrode can be made uniform, the variationin characteristics can be decreased, and the defect rate can bedecreased. Since the domain structure can be made uniform, aferroelectric memory element highly resistant to write fatigue can beobtained.

Note that the shape of the ferroelectric film viewed from the side isnot limited to those shown in FIGS. 30 and 31. The shapes shown in FIGS.18A to 19N can also be employed.

When the present invention is applied to magnetic devices such asmagnetic memory elements, for example, the number of defective memorycells can be decreased since the coercive force necessary for rewritingthe information of a magnetic memory element can be made uniform. Thus,the capacity of magnetic random access memories can be increased, theprice thereof can be reduced, and the area of a chip can be decreasedwhile improving the reliability. Moreover, the biasing magnetic fieldthat allows a read element to exhibit linear response can be decreased.As a result, the sensitivity and the reliability of the magnetic readhead can be improved, and the head can be used in association withhigher-density recording media. When the present invention is applied toa magnetic medium formed of micro magnetic particles, the transitionalnoise can be reduced since the coercive force can be made uniform. Thus,the linear recording density can be improved, and the transmitting ratecan be increased.

When the present invention is applied to ferroeletric devices such asferroelectric memory cells, for example, the depolarization fieldnecessary for rewriting the information on the ferroelectric memoryelements can be made uniform, and the number of defective memory cellscan be reduced. Thus, the capacity of ferroelectric memories can beincreased, the price thereof can be reduced, and the area of a chip canbe decreased while improving the reliability.

1-12. (canceled)
 13. A ferroelectric device comprising a unit elementcomprising a ferroelectric film, wherein part of the outline of the unitelement is topologically identical to one of a letter-C shape and aletter-S shape that correspond to the polarization distributionimmediately before rotation of polarization.
 14. The ferroelectricdevice according to claim 13, wherein the unit element is disposed abovea logic circuit.
 15. The ferroelectric device according to claim 13,wherein the unit element is disposed inside a trench.
 16. Theferroelectric device according to claim 13, wherein the unit element isconnected to a MOS transistor. 17-18. (canceled)
 19. The ferroelectricdevice according to claim 13, wherein, the outline of the unit elementincludes one of: at least one elliptic arc; a set of straight linesegments or a straight line segment obtained by a polygonalapproximation of an elliptic arc or a part of an elliptic arc; and a setof straight line segments connecting three or more apexes. 20-21.(canceled)
 22. The ferroelectric device according to claim 19, whereinthe unit element has a semi-elliptic shape having the outline consistingof: an arc or an approximated arc; and an inwardly or outwardly curvedsegment. 23-24. (canceled)
 25. The ferroelectric device according toclaim 19, wherein the unit element has rounded apexes rounded by a curveor polygonal approximation. 26-27. (canceled)
 28. The ferroelectricdevice according to claim 19, wherein the outline of the unit elementincludes a plurality of semi-ellipses or approximated semi-ellipsesopposing each other or being displaced from each other.